Fabrication and Chip Packaging Lead
About the role
We are seeking a Fabrication and Chip Packaging Lead to drive packaging strategy, fabrication coordination, and assembly development for advanced devices and subsystems. This role is critical to bridging design, process development, and scalable manufacturing for complex quantum hardware.
What you’ll do
- Lead packaging architecture and fabrication coordination across internal and external partners
- Develop assembly flows for high-density, cryo-compatible, photonic, or otherwise specialized devices
- Improve yield, manufacturability, reliability, and integration across prototype and production builds
- Work closely with design, test, and systems teams to ensure hardware can be packaged and deployed at scale
What we’re looking for
- Strong experience with microfabrication, chip packaging, assembly processes, and vendor coordination
- Expertise in packaging for cryogenic, photonic, RF, or high-density electronic systems
- Understanding of materials, process constraints, and failure mechanisms in advanced hardware
- Ability to lead cross-functional execution from concept through scaled buildout
Location: Camperdown, Sydney, Australia however we are also open to applicants residing in, or willing to move to, Australia and the US.
Job Type: Full-Time
About Us: Emergence Quantum is a company at the forefront of quantum technology, driving innovative solutions in quantum computing, cryogenic electronics and communication.
Benefits:
- Competitive salary and performance-based bonuses.
- Opportunities for professional development and career growth.
- Collaborative and innovative work environment with opportunities for flexibility.
- Emergence Quantum is an equal opportunity employer.
- The role is open to both domestic and international applicants.
How to Apply: Interested candidates are invited to submit their resume and cover letter to careers@emergencequantum.com with the subject line "Fabrication and Chip Packaging Lead".
Click here to submit your application.